Business
AP Systems, moving forward into the world with a passion for endless research and technological developments
Display(Back-End Process)
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Semiconductor
- Rapid Thermal Process
- Sputter System
- Descum System
- Laser Dicing
- Laser De-bonder
- Wafer Dicing
- Laser Annealing
- Laser Ablation
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Display
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Front-End Process
- Excimer Laser Annealing
- Laser Lift-Off
- Glass Encapsulation
- ALD
- Film Laser Cutting
- PECVD
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Back-End Process
- Module Lamination
- Module Dispenser
- Module OCR Inkjet
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Front-End Process
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EV Battery
- NG SORTER
- TRAY WASHER
- CELL TAPING
- CELL PACKING
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Solar Cell
- LEI
- LDSE
- LCO
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Module Lamination (Vacuum Chamber Lamination)Automatically inputs/supplies panels and raw materials (UTG, PSA), and performs lamination. Applicable to 2D/3D/Automotive/ROLL/4side curve PNL process.
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Module Dispenser(BPL and other dispensers)Provide the optimized equipment for quantification and coating thickness by resin type. User-friendly UI programming for convenient driving. Provides precision application by the dispensing head’s management of the discharge of chemical liquid. Monitoring discharge droplet mode(Weight, volume, speed, etc),vision checking and data classification algorithm. Chemical liquid capacity check and productivity increase due to reduced defect rates due to secure replacement cycles.
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Module OCR InkjetProviding the best equipment according to the ink characteristics and application fields. User Friendly UI programming and convenient operation. Auto-alignment technology allows for easy head/pack replacement and precise printing. Droplet measurement and vision inspection system and data sorting algorithm.
