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AP Systems, moving forward into the world with a passion for endless research and technological developments

Solar Cell

  • Semiconductor
    • Rapid Thermal Process
    • Sputter System
    • Descum System
    • Laser Dicing
    • Laser De-bonder
    • Wafer Dicing
    • Laser Annealing
    • Laser Ablation
  • Display
    • Front-End Process
      • Excimer Laser Annealing
      • Laser Lift-Off
      • Glass Encapsulation
      • ALD
      • Film Laser Cutting
      • PECVD
    • Back-End Process
      • Module Lamination
      • Module Dispenser
      • Module OCR Inkjet
  • EV Battery
    • NG SORTER
    • TRAY WASHER
    • CELL TAPING
    • CELL PACKING
  • Solar Cell
    • LEI
    • LDSE
    • LCO
  • LEI (Laser Edge Isolation)

    This equipment is used to improve the light absorption efficiency of new Perovskite/Silicon tandem cells by short-circuiting the outer TCO layer using a UV pico-second laser.

  • LDSE (Laser Doped Selective Emitters)

    This equipment enhances light absorption efficiency by generating highly doped emitter regions on a dopant-infused wafer through irradiation with a green pico-second laser.

  • LCO (Laser Contact Opening)

    This equipment removes aluminum oxide from the rear side of the cell using a green nano-second laser.

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