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De-Bond Process System
It is a process to seal with Glass to prevent penetration of oxygen and moisture, after all the processes of AMOLED has been progressed. It performs sealant process of large area AMOLED, at least the size of generation 4, and we provide facilities for the entire sealant process, unique in Korea.
After spraying the sealant to draw the shape of outward appearance, and then going through the assembly process of upper board and lower glass board, UV is irradiated to harden the sealant.
Semiconductor Temporary Bonding (TB) System
It is a process of temporary bonding the Carrier Wafers, so the Patterning and Handling of the film Wafer/Panel could be done easily, and an equipment system for Film Lamination of Wafer surface.
|Lamination Process Vacuum Pressure||9 x 10-2 ~ 10-1 Torr|
|Process Pressing Force||~7.0 ton|