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It is a Laser Lift-Off system designed for Flexible Display. Using laser, optics technology, and process modules, Carrier Glass is separated from the board to manufacture thin film devices. It is a core facility in the flexible display manufacturing process.
Irradiate Excimer Laser to separate polyimide (PI), which is a plastic material, formed on the glass board.
Laser Type | Excimer Laser |
---|---|
Laser Wavelength | 308nm (XeCl) |
Laser Repetition Rate | 600Hz |
Laser Pulse Energy | 1J, 2J |
Laser Uniformity | Long Axis (2σ): ≤ 1.8% (@96%), Short axis (2σ): ≤ 3.0% (@96%) |
Stage Type | Single Plane or Stack Plane |
Stage Position accuracy | X1, X2 axis: <±4um, Y1, y2 axis: <±4um |
Process Environment | ATM |
Software | Easy Cluster™ |
Safety Certification | CE, SEMI, S-Mark |