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Substrate Loading | Generation 6, 2 Partition, 925mm x 1500 mm |
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Board Temperature | Max. 90℃ |
Water Vapor Permeability | < 5e-5 g/m2/day @ 1000Å, SiNx/SiOx multi-layer structure |
Film Thickness Uniformity | < 5% |
Light Transmittance | > 90% @ all the ranges of visible light |
Stress | <±100 MPa |
PVD600: CPB & FOWLP
PVD600_R450: FOPLP
Substrate Loading | Generation 6, 2 Partition, 925mm x 1500 mm |
---|---|
Substrate Temperature | Max. 90℃ |
Water Vapor Transmission Rate | < 5e-5 g/m2/day @ 1000Å, SiNx/SiOx multi-layer structure |
Thickness Uniformity | < 5% |
Optical Transmittance | > 90% @ all the ranges of visible light |
Stress | <±100 MPa |
PVD600: Single Backbone
PVD1000: Dual Backbone
Common | Temperature Uniformity(@ Degas of 300℃): ≤ 5% |
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Etch Uniformity(@ Pre-Cleaning) :≤ 5% | |
Film Uniformity(@ Process) : ≤ 3% | |
Throughput (@ Ti : 250Å, Al : 6000Å, TiN : 250Å) |
PVD600 : ≥ 39 sheets/hr |
PVD1000 : ≥ 52 sheets/hr |
Substrate Loading | Generation 6, 2 Partition, 925mm x 1500 mm |
---|---|
Substrate Temperature | Max. 90℃ |
Water Vapor Transmission Rate | < 5e-5 g/m2/day @ 1000Å, SiNx/SiOx multi-layer structure |
Thickness Uniformity | < 5% |
Optical Transmittance | > 90% @ all the ranges of visible light |
Stress | <±100 MPa |