Business
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Display(Front-End Process)
Plasma Enhanced Atomic Layer Deposition System(KORONA™ ALD)
- KORONATM ALD can be deposited in a low temperature compared to thermal ALD by using plasma
- Application : Active layer, Buffer layer, Encapsulation layer
Technology
- Large area deposition system using plasma scanning
- Large area deposition system using gas nozzles
- Large area deposition system using laminar flow & showerhead
Features
- Good step coverage
- Long PM period
- High deposition rate
- High density thin film
- High throughput
Specification
| System Configuration | 1 Process Chamber(2 Reactor) |
|---|---|
| 2 Slot Loadlock(Semi Auto Loading) | |
| Substrate Size | 730 X 920mm |
| Film Uniformity | <±3% |
| Sub. temperature | 25℃ ~ 250℃ |
| Process Pressure | 1 ~ 10 torr |
| Precursor Source | TMA, DEZ, DIPAS, DADI, TEGa, O2, Ar, N2, H2O… |
| Foot print | 1200(W)*4500(L)*2400(H) |
| Deposition | ALD(Atomic Layer Deposition) - Plasma function included |
| Control | PC Control |
