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AP Systems, moving forward into the world with a passion for endless research and technological developments

Display(Back-End Process)

Module Lamination

Vacuum Chamber Lamination

  • Automatically inputs/supplies panels and raw materials (UTG, PSA), and performs lamination.
  • Applicable to 2D/3D/Automotive/ROLL/4side curve PNL process

Technology

  • Optimizing the design of silicon PAD applied to 3D construction method for new products
  • Optimize design and improve product quality through particle path and airflow analysis
  • Auto Mapping and OFFSET Auto application due to APC algorithm
  • Minimize JOB CHANGE time by providing Auto Camera Calibration
  • Provide 2D & 3D Lamination Change (by Lego Block detachable mode)
  • Provides function to minimize defect rate by providing ESC foreign body inspection function

Specification

Pressing Capacity 2.5TON ~ (TBD)
Align style and point(bonding) VISION / 2parts_4parts can be aligned
Bonding precision < ±80um (TBD)
Material size 3”~ (TBD)
Input style Magazine AUTO TYPE (TBD)
Application Phone, Foldable, Tablet, Note Book Process for Display)
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