Business

AP Systems, moving forward into the world with a passion for endless research and technological developments

Semiconductor

Rapid Thermal Process

We provide rapid thermal process equipment, the core equipment in the
entire process of semiconductors, to the client companies.

  • Rapid Thermal Processing(RTP) equipment, which treats wafers with high temperature in a short time using tungsten halogen lamps, is applied to
    various processes such as implantation and diffusion.
  • Rapid Thermal Process
  • Soak
    Spike

Technology

It is a non-contact rotation using magnet properties (Magnetic Levitation), which secures excellent temperature uniformity within the surface.

Specification

Features

  • 2 Chamber
  • ATM equipment
  • 3 Load Port
  • Integral MPD
Item Description Unit Specification Remarks
EFEM Load Port Quantity Set 3 LPP(option)
ATM-Dual Robot Set 1
Process Module Heater Block Process Pressure Torr 800 ~ ATM
Ch. Body
T Shape LAMP Quantity ea 290
Power Electrical Rack SPEC General Power 208V, 3PH, MCCB630A
Temp. Control Performance Control Range ℃ 450 ~ 1150℃ ±1.5℃ Control
Ramping-Up ℃ Max. +250℃/sec spike
Ramping-Down ℃ Max. -90℃/sec
Pyrometers per chamber Quantity ea 5
Process 49 Points RTO Range Å ≤1 @1σ

Features

  • 3 Chamber
  • Vacuum equipment
  • 3 Load Port
  • Seperate MPD Box on the lower side
Item Description Unit Specification Remarks
EFEM Load Port Quantity Set 3 LPP(option)
ATM-Dual Robot Set 1(with Aligner)
VTM Stack Load Lock Quantity Set 4 Particle Free
Pentagon VTM Set 1
Process Module Heater Block Process Pressure Torr >2
Ch. Body
T Shape LAMP Quantity ea 290
MPD Electrical Rack Quantity Set 3
SPEC General Power 208V, 3PH, MCCB630A
Temp. Control Performance Control Range ℃ 450 ~ 1150℃ ±0.5℃ Control
Ramping-Up ℃ Max. +100℃/sec
Ramping-Down ℃ Max. -40℃/sec
Pyrometers per chamber Quantity ea 5
Process 49 Points RTO Range Å ≤1 @1σ
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